2 for conduction cooling • VITA 46 board connectors • IEEE 1101. Operating Temperature: -40C to +85C. Some cards, especially FPGAs, may approach 300 watts per slot, which can be a challenge even for liquid cooling. 2) VPX router serves as an. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. VX3060-S2 Rugged Air cooled variant is designed to meet VITA 47 class EAC6 V2 and can operate in extended temperature environ-ments up to of -40 °C/+70 °C. System designers therefore have two choices: Either move to VITA REDI alternatives or. Conduction cooled or air cooled; Conformal coating; RoHS or leaded soldering; SWaP (Size, Weight, and Power) Long-term product availability and support;. Products. This enables the VX305C-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. Higher conduction means lower component temperatures . 0 and VITA 65 connector interoperability. 0 specification for use in Mil/Aero VPX systems. The XPedite8101 is an Intel® Atom™ E3800-based XMC/PMC available in conduction- and air-cooled configurations. pitch conduction-cooled CompactPCI modules. While air and conduction cooling are often implemented to address cooling challenges, liquid cooling solutions can be effective for designs at the chassis, board, and chip levels. The board supports tunable bandwidths from 200 kHz to 56 MHz over a frequency range from 70 MHz to 6 GHz. Air (Convection) Cooled – ANSI/VITA 48. The chassis can accept a front and a Rear Transition Module (RTM). Accommodating cooling methods that include forced air, conduction, and liquid. The logic-optimized FPGA is well-suited for a. With multiple high-speed fabric interfaces, x8 PCI Express Gen3, 12 high-speed fiber-optic transceivers, and 8 GB of DDR4-2400 SDRAM in two channels, the. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. ca. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards; Verifi es chassis can meet power. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. Fax: (604) 875-5867. U-Blox), or secure SAASM M-Code GPS receiver. Up to 20 CFM of airflow is provided per slot. The WC31DH Chassis incorporates slots for up to eight conduction-cooled 3U VPX Payload Boards, two HD Switches, a Radial Clock, and two VITA 62 power supplies. Login. The XPand1205 is a low-cost, flexible development platform, supporting up to eight 0. FEATURES. 1940000519-9001R 3U VPX Extender 3U for conduction cooled boards in conduction cooled chassis VITA 67. Conduction-cooled, rugged 3U VPX form factor. 0 in. 3U Conduction cooled models available on 1″ form factor. The SP306R-VPX StorePak™ is a removable single slot air-cooled 3U VPX storage module designed to be used either in conjunction with Critical I/O’s StoreEngine storage manager, or as a stand-alone Direct Attach Storage device. It also supports dual Gigabit Ethernet, GPIO, I²C, XMC I/O,. Contact factory for appropriate board configuration based on environmental requirements. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. Nerve conduction studies (NCS) are tests used to evaluate the function of the peripheral nerves. 3 V. Axis Tool Suite, Health Toolkit, Hardware. This design and development were by MSS, including all the Windows-based software and qualification to full DO-160. LCR’s 19” 3U VPX Development Chassis for small to large scale projects is a rackmount or desktop solution for VPX and SOSA aligned payloads. 10 Rear transition module on VPX VITA 46. 3U VPX carrier card. The 3U VPX backplane uses standard 1. XPand6902. 8 Air Flow Through Cooling; Powerful push-pull cooling of front cards. Horizontal air-flow cools over 150W per slot to support state-of-the-art processor boards. Higher conduction means lower component temperatures . The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. It supports up to 16GB of on-board DDR3 ECC memory and supports mSATA SSD. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. 2 mechanicalformat. Our Card and Software Packages are Designed for Fast, Portable Integrations. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction cooling. Description. The module utilizes Vicor proprietary technology to enable high efficiency and power density for this highly rugged, conduction-cooled model. -40 - 85°C (Conduction Cooled) Capture only. SATA, PCIe, and NVMe interfaces. [Table 1| These numbers compare cooling capacity using passive, air-assist, and liquid-assist conduction cooling in six-slot VITA 48. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. The heat from the internal conduction-cooled. As system density has increased, the need for more aggressive and innovative thermal management techniques are needed. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. 3 V @ 9 mA to 60 mA) 1 PPS Output: TCXO OCXO OCXO Rugged Option (VPX only) Accuracy to UTC (1-sigma locked to GPS) ±50 ns ±50 ns ±25 ns Holdover (constant temp after 2 weeks of GPS lock) After 4 hours 12 μs 3 μs 1 μs After 24 hours 450 μs 100. This product is compatible with the USRP Hardware Driver (UHD) maintained by NI in a VPX SDR. 40GbE. Learn more about this product below »XMC Module | Conduction- or Air-Cooled. Elma Electronic’s NetKit-3110 is a rugged, conduction-cooled router based on the Cisco ESR6300. Folder. 125 Gb/sec. VPX-XMC Conduction-Cooled Adapter Assembly . manufactures a variety of COTS modular designed conduction cooled chassis for VPX, VME, CPCI and CPCIexpress applications,. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. The VPX3-663 combines a PCIe Gen 3. Product Type: Guide Rail. Block Diagram. 2 conduction cooled module and supports 6 payload slots and 2 VITA 62 power supplies. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. 85" or 1. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. 0 Ruggedized Enhanced Design Implementation. RuSH controlled power and cooling supports high current demands and corresponding high cooling. The specification of 6U VPX calls for computer cooling via a conduction-cooled envelope compliant with the IEEE standard IEEE-1101. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. It is designed to work as the system controller in command, control, communicate and compute applications and has a wide range of interface and storage options. Just like the NI Ettus Research USRP E320, the VPX3-E320 features a flexible 2 x 2 MIMO RF Agile Transceiver with 12-bit ADC and DACs. The development kit includes the cables needed to connect the XPand6200. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. However, as module power continues to increase, VITA 48. Learn more about this product below »Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. 8 in. 3V_Aux. Creation of a specific board-cage to integrate conduction cooled VPX boards into a ventilated chassis. Accessories. Air-cooled models include an additional 10/100/1000Base-T port available on the front panel RJ45 connector. Form Factor: 3U VPX. Reviews aren't verified, but Google checks for and removes fake content when it's identified. 8 in. The adapter includes a PCIe switch chip. Conduction-Cooled Option. A conduction-cooled option is available for more rugged operating environments. OC-CC-VPX-3U-5HP-SS-300-LB48 WT ASSY # - 43094 3U VITA 48. Kontron's selection of VPX switches includes fully managed 10 Gigabit Ethernet switching and up to 28 ports Gigabit Ethernet switching. The XChange3000 provides easy integration of standard mezzanine cards into modern VPX backplanes. VStream-VPX Datasheet Order Enquiry for VStream-VPX. Grabcad 3U Vita Card. The versatile design allows multiple customizable configurations based on proven components and design techniques. True 6-Channel design provides full OpenVPX. 8 in. 3 Up to 24x 10 GETH. Conduction cooling is defined as the transfer of heat through solids. VPX hold up power supply is a type of power supply used in high-performance computing applications. 6U Conduction Cooled VPX Extender. 3U OpenVPX™ form-factor (VITA65) Xilinx Kintex-7 325T/410Tuser-programmable FPGA. Visit Product page. View product. Clear all Compare. LCR’s product line of rugged ATR chassis and integrated systems offer VPX packaging solutions for applications requiring 1-slot to 18-slots. 6-slot, 3U OpenVPX (VITA 65) backplane, 1-in pitch. The heat from the internal conduction-cooled modules is conducted to sidewall exchangers, where it is dissipated to the ambient environment by forced-air cooling. It supports up to two 0. 4. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. Intel® Xeon® D-1500 Processor-Based Rugged Small Form Factor (SFF) COTS System with Xilinx Kintex® Ultrascale™ FPGA. FPGA Family. It features dual 9 slot backplanes including PSU slots. 65 in. -50°C to +100°C Relative Humidity 95% non-condensing Altitude 60,000 feet, operating Power Consumption 52. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector. , a leading supplier of conduction cooled VPX systems, has been awarded by a prime contractor based in Maryland, to deliver DesertGecko 3U VPX systems based on Juniper Networks LN 1000 router and PCI-Systems managed conduction cooled Gigabit Ethernet switch. Utilizing our extensive experience in embedded. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Combine various standard components to create a Wedge Lok that satisfies your requirements. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. Level 1-5 Air, Conduction Cooled. Conduction- or Air-Cooled 3U VPX-REDI XMC/PMC Carrier Card. 0 Serial: 2 RS-232/422/485 SATA: 4. 3U Open VPX, MOD3-SWH-2F24U module; Air-cooled - Backplane: 22x 10GBase-KR, 1x 10/100/1000Base-T user configurable front panel or backplane. (W) x 5. Type: Conduction Cooled Assembly VPX. Development chassis for VPX and SOSA aligned module payloads. Innovative Integration recommends that all electronic assemblies and components circuits be handled with appropriate precautions. Accessories. 11. One high-speed link on VPX-P1(control plane) Up to twelve high-speed linkson VPX-P1. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). Fast backplane replacement makes for easy reconfiguration in support of every stage of development. 84 W Weight Conduction cooled: 535. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. VPX-TF3090 3U VPX conduction cooled test frame with tBP-VPX3000. or 1. • VITA 46 3U VPX available in conduction cooled -40-+85C environments as well as harsh vibration profiles DESCRIPTION FEATURES & BENEFITS 3U 10G VPX ETHERNET SWITCH AMPHENOL FAMILY OF RUGGEDIZED ETHERNET SWITCHES AAO Part Number Cooling Method Backplane Top AAO RTM Part Number AAO RTM Part. AFT relies on a heat frame that clamshells onto the entire board’s electronics. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. 00730 VITA 62 and MIL-STD compliant 3U DC-DC supply provides up to 360W output power while operating with highest efficiency. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. pitch air-cooled VPX (VITA 48. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). For use in DC systems, they are 3 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. ENHANCE THE PERFORMANCE & RELIABILITY OF YOUR SYSTEM WITH ONE DESIGN DECISION. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. XIt1086. manufactures and sells Power Supplies for various COTS architecture systems to include custom and standard designs. pitch with solder-side cover; Environmental Requirements. The LoC-600 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VITA 48. Select one of the products below to see specifications and learn more. (L) x 4. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled; DEV-4117 Hybrid. It supports up to two 0. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. Air flow from bottom to top (Other options available on request) Standard 3U rear transition module. Depending on local conditions, packaging and freight charges might not be included. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your. The liquid-cooled chassis sidewalls will. Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX™ compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. A pass-through backplane is also available, enabling the application developer to cable any desired topology. This large scale, naval system had a complete HiK™ back-plane and utilize natural convection cooling. Our Card and Software Packages are Designed for Fast, Portable Integrations. VPX plug-in LFT modules use liquid flowing through an integral heatsink of the module for cooling the circuit board. VPX 3U/AC Power Supply 600W. VPX Backplane, 3 U, 5 Slots, Full-Mesh, Without RTM. Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI. pitch conduction-cooled VPX (VITA 48. Each DCM has 3Commercial Air-Cooled. or 1. Compare. PXI Express Chassis Systems. Convection Cooled: SMA Jack (+3. 3VIO, Short tail connectors on J1, long tail connectors on J2. Hover over a product and select Compare to add to comparison set. Mobile workstation processor performance with enterprise-VPX Meritec Cable Module (Odd or Even) Daughter Card for Host board (Air or Conduction cooled). The standard configuration includes two 10/100/1000BASE-T Ethernet ports, seven. The COOL-CC3 chassis is a 6-slot, 3U, VPX, forced-air, conduction-cooled portable tower chassis ideal for lab development. Also Available: A rugged ATR versionFeatures. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. Acromag VPX products are designed for COTS applications. 0 in. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. This highly ruggedized conduction cooled unit provides a versatile multifunction clock references for any environment. The XChange3031 provides one backplane 40GBASE-KR4 Ethernet port, six backplane. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 97"H Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. 0, 2. NXP (formerly Freescale) QorIQ T2081, T1042, or T1022 Processor-Based Conduction-Cooled XMC/PrPMC Mezzanine Module. Standard Air- and Rugged Conduction-Cooled Versions; Download Datasheet Request information Add to compare. close. It is available in air-cooled and conduction-cooled versions. 2 conduction cooled modules because of their established deployment track record. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. It supports 3rd Gen Intel Core series processor and Intel QM77 chipset. 85°C (derating above 60°C) Size: 3U, 0. They are low-power system-on-chip (SoC. AFT for VPX is supported with variations (“dot specifications”) through VITA 48. Pixus also provides conduction-cooled and customized OpenVPX enclosure solutions. pitch conduction-cooled CompactPCI modules. 1 compliant products to extend the temperature range of operation to drive the costs down To keep the weight low to avoid the use of other less cost effective solutions based for instance on the VITA 48. 0 in. 8 are already available, such as this 3U VPX COTS system with air-flow-through cooling. A XMC module can therefore have two PCIexpress chips on board without using an additional switch on the XMC board. 3"H Chassis Cooling: Conduction-Cooled Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O 1 * Kintex® UltraScale™ FPGA. VENRAY, the Netherlands July 21st 2010 - VSN Systemen bv, a leading telecom hardware and software developer, launches OpenTSP NG technical building blocks,which are essential for the development of the newest multimedia applications. TR E8x/msd-RCx – Rugged 3U VPX Processor. VX3800 is a 3U VPX carrier designed to support any standard XMC/PMC mezzanine and expand I/O flexibility to VPX systems. The carrier card routes power and bus signals to a plug-in mezzanine module through the VPX card slot connector. Data Plane. . VPX MEDIA CONVERTER MODULE SUMMARY CF-020010-57X 57X Block Diagram VITA 48. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction. 0 in. Up to four power supplies can be paralleled to increase. or 1. 1 * Kintex® UltraScale™ FPGA. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. The VX305H-40G is also available with. Spare Power Supplies for W-IE-NE-R NIM and CAMAC chassis, providing high power density and low ripple and noise. N/A. It supports up to two 0. 85 and 1 in. Our AoC chassis are designed for mission critical defense applications in the most extreme. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. (604) 875-4405. Eight 6U VITA 48. 0 inch pitch. pitch slots and built in accordance. View. With multiple high-speed fabric interfaces, external memory, Xilinx Virtex-7 FPGA, an FMC site, and high-density I/O, the XPedite2470 is ideal for customizable, high-bandwidth, signal. 1. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. The SX-150 is available in the VITA 48. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. 0 specification. SX-153 Dual-Enclave 100/40 Gigabit Ethernet Switch. Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector. Max 10. 1) modules. 85" pitch ver-sion allows for the top and bottom coversDesigned specifically for high-powered, conduction-cooled modules, the AVRO-2 is a compact solution in a 2-slot 3U VPX chassis. operatiNG temperature 0°C to +55°C Air-Cooled; -40° to +85°C Conduction-Cooled staNDarDs Open VPX MOD3-SWH-2F24U module usable in SLT3-SWH-2F24U-14. 6GHz Thirty-two. VPX 3U Load Board - Conduction cooled: LXH0000840. Block Diagram. Form Factor: Custom Chassis Type: Custom. VITA 62 3U 400W AC/DC VPX power supply; Universal AC Input: Single Phase, 85-264VAC, 47-400Hz;Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. The 12 slot power and ground backplane supports VITA 48. 8 in. XChange3012 3U VPX Switch | PCI Express | Gigabit Ethernet Integrated | XMC Support. Chassis Example: WILD40 Forced-Air, Conduction-Cooled 3U OpenVPX Chassis has an operating temperature of –40˚C to +70˚C. Our expertise also includes VITA 66,. The XPand1007 system is a low-cost development platform for conduction-cooled 3U VPX cards. 48. Related links and. Quick. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. This fully-defined, backplane-centric VPX module optionally supports either commercial GNSS receivers (i. Embedded RuSH TM technology. This allows testing of the conduction cooled modules without going through the thermal chamber. 3U Conduction cooled models available in 1″ form factor. OpenVPX now boasts several standards that provide various means of dissipating heat within a system. AT-VPX-PMC/XMC-CAR is one of a family of modules to employ open architecture VITA 46 standard primarily to marry High Speed Interconnect such as Rapid IO and PCI Express. 2 chassis, heat is conducted away from hot module components through the heat sink and out to the module wedge locks. or 1. The logic-optimized FPGA is well. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. 8 in. The SBC627 rugged 6U VPX single board computer offers more processing power, more bandwidth, and more graphics capability – with no increase in the size, weight or power requirements of previous generations – enabling fewer system slots to be used. The heat from the internal conduction-cooled modules is. The Ethernet fabrics allow VPX cards within the system to communicate and also have access to an outside local area network. 8 in. VPX6860: 6U AcroExpress OpenVPX SBC Air or Conduction-Cooled Features & Benefits. XPand1007. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. Request Information close. True 6-Channel design provides full OpenVPX support. VPX™ interface- OpenVPX™ VITA 65 MOD3-PAY-2F2T-16. e. A ternary biochar/vanadium pentoxide/graphite like carbon nitride (BC/V2O5/g-C3N4 denoted BC/VO/CN) composite was prepared by a simple hydrothermal method and its. The Rise of VPX Cooling Requirements VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. The XChange3031 provides one backplane 40GBASE-KR4 Ethernet port, six backplane 10GBASE-KR. (H) Four 0. Form Factor: 3U VPX Ethernet: 4 10/100/1000BASE-T USB: 2 USB 2. VITA 62 Compliant 3U VPX power supply. ACT developed an integrated design and delivered turnkey parts that were developed to be highly ruggedize and provided thermal conductivity > 750 W/m-K. VPX and SOSA aligned slots may support VITA 66 and. The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. See the Rugged section for more details. View product Compare. 2 SSD 1; Up to 64 GB (2x 32 GB) NAND Flash; a straightforward,. Author: Reggie. The carrier card routes power and bus signals to a plug-in mezzanine module through the VPX card slot connector. They can be used to power a VPX chassis and will fit into the standard envelope defined by. Designed for COTS applications this Intel SBC utilizes the Intel C230 series PCH chipset for extensive I/O support. MicroTCA CompactPCI /-Serial PXI and PXI Express VME and VME64x VPX Systems Hardware Platform Management Components -. The 3U VPX to PCIe Adapter acts as a PCIe switch, providing an electrically and mechanically optimized interface between PCIe boards and VPX systems. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. 3 V @ 9 mA to 60 mA) Conduction Cooled: MMCX Jack (+3. 34. 62H. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). It operates as an all-in-one solution for video capture, process, encode, decode, stream, and display. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. Input: 80 to 264V AC. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. 10 RTM slots for accessing I/O from the corresponding 3U VPX modules installed in the XPand6200 Series. Designed to meet the requirements of VITA 62 for use in harsh environments. 6 Gigabit Ethernet Control Plane on VPX VITA 46. The Condor GR5-P2000 is a 3U VPX graphics & GPGPU card that is based on the “chip-down” NVIDIA® Quadro® Pascal™ P2000 GPU (GP107). In 2016, VITA announced the formation of a working group that will develop a new AFT cooling standard-VITA 48. 2) modules. PWB area and improved thermal management (air-cooled, conduc-tion-cooled, liquid flow-through cooling), enabling increased func-tional density and providing support for use as an LRM. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo frames up to 10 kB. 8 GHz) with 96 EU Intel® Iris® Xe Graphics48. The Intel® Atom™ E3800 processors provide excellent computational performance and I/O functionality for their power profile and size. However, as module power continues to increase, VITA 48. 0 in. 1 PICMG 2. 8”. 11-1019958-x4 = Conduction cooled version 47915 Westinghouse Drive, Fremont, CA 94539 phone 510-657-4444 fax 510-657-3274 [email protected]″ form factor. 2-7. 8 in. Provision is also made for air-cooling via. AT-VPX-Carrier carrier card offers maximum flexibility to system. WOLF’s 3U VPX modules use the 1" pitch allowed in VITA 48 (VPX REDI). Conduction-Cooled. or 1. Both are designed to support a minimum of ten 0. Supported ruggedization levels (see the X-ES. XIt1076 (90060330) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DisplayPort XIt1086 (90040055) - 3U VPX RTM with Serial, Ethernet, USB, SATA, PCIe XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1200 (90070530) - 3U. Metal frames under the electronics that serve as heat spreaders to move heat to the card edge; Card retainer clamp/wedge lock to mechanically and thermally attach the card to the chassis3U VITA 62 compliant universal AC input 400 watt 6 channel plug-in or bulkhead mounted power supply for air or conduction cooled OpenVPX systems. VPX carrier cards provide a simple and cost-effective solution for interfacing mezzanine I/O modules to a VPX computer system. 8” pitch. (L) x 4. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. Features. ANSI/VITA 48. of air cooled VPX plug-in units Improve the cooling of VITA 48. 3U CompactPCI 2. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. The XPedite7770 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring. 3U VPX with NVIDIA Jetson AGX Xavier Industrial and ConnectX-6, SOSA aligned Payload profile module for HPC tasks such as sensor data processing, machine vision, and other C4ISR tasks. The Behlman VPXtra® series of COTS AC to DC and DC to DC power supply are rugged, highly reliable, conduction cooled, switch mode unit built for high-end industrial and mission critical military. The . The VX305C-40G is also available with a VITA 48. VITA 62 Compliant 3U VPX power supply. FPGA BSP (FBSP) High-Speed Links (HYDRA) Advanced Board Management Controller (aBMC) Highlights. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX; This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. or 1. Power and reset LEDs are provided for. DECISIVE PERFORMANCE. This Model Can be used to design the VITA Card Chassis. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. 30 in. pitch;. Designed for COTS applications this Intel SBC utilizes the Intel C230 series PCH chipset for extensive I/O support. 3 to the P15 connector for interfacing with the host module. Form Factor: 3U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 11. Formally known as ANSI/VITA 48. LOWER RISK. 0 in. COOLING EMBEDDED VME AND VPX SYSTEMS. For all rugged environments: Air, Land, and Sea. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A Technology: VPXVPX336 / VPX340 are State-of-the-art, rugged VITA62 compliant 3U/0. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. The IC-INT-VPX3k is a 3U VPX Single Board Computer built around the Intel® Xeon® W (code name Tiger Lake-H) processor. or 1.